Evaluation and Selection Methods of Conductive Adhesives and Solder Materials
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F07%3A00167861" target="_blank" >RIV/68407700:21230/07:00167861 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Evaluation and Selection Methods of Conductive Adhesives and Solder Materials
Original language description
Conductive adhesives and solder materials are used for assembly of electronic components. The selection of them has got a large number of valuation criteria. The use of new adhesive material and different solders depends on results of tests about their properties.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
—
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2007
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
ISSE 2007
ISBN
978-1-4244-1217-4
ISSN
—
e-ISSN
—
Number of pages
2
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Cluj-Napoca
Event date
May 9, 2007
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—