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Evaluation and Selection Methods of Conductive Adhesives and Solder Materials

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F07%3A00167861" target="_blank" >RIV/68407700:21230/07:00167861 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Evaluation and Selection Methods of Conductive Adhesives and Solder Materials

  • Original language description

    Conductive adhesives and solder materials are used for assembly of electronic components. The selection of them has got a large number of valuation criteria. The use of new adhesive material and different solders depends on results of tests about their properties.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2007

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    ISSE 2007

  • ISBN

    978-1-4244-1217-4

  • ISSN

  • e-ISSN

  • Number of pages

    2

  • Pages from-to

  • Publisher name

    IEEE Press

  • Place of publication

    New York

  • Event location

    Cluj-Napoca

  • Event date

    May 9, 2007

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article