Electrical Connection Network Within an Electrically Conductive Adhesive
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F08%3A00143863" target="_blank" >RIV/68407700:21230/08:00143863 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Electrical Connection Network Within an Electrically Conductive Adhesive
Original language description
This article compares theoretical models with real measurement of the electrically conductive adhesive. The inner structure of the adhesive that is either formed by micro-sized particles, or micro-sized particles mixed with nano-sized particles, is described.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2008
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
31st International Spring Seminar on Electronics Technology
ISBN
978-1-4244-3973-7
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
IEEE
Place of publication
New York
Event location
Budapest
Event date
May 7, 2008
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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