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Electrical Connection Network Within an Electrically Conductive Adhesive

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F08%3A00143863" target="_blank" >RIV/68407700:21230/08:00143863 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Electrical Connection Network Within an Electrically Conductive Adhesive

  • Original language description

    This article compares theoretical models with real measurement of the electrically conductive adhesive. The inner structure of the adhesive that is either formed by micro-sized particles, or micro-sized particles mixed with nano-sized particles, is described.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2008

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    31st International Spring Seminar on Electronics Technology

  • ISBN

    978-1-4244-3973-7

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

  • Publisher name

    IEEE

  • Place of publication

    New York

  • Event location

    Budapest

  • Event date

    May 7, 2008

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article