Electrically Conductive Adhesive with Micro-Nano Filter
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00182916" target="_blank" >RIV/68407700:21230/11:00182916 - isvavai.cz</a>
Result on the web
<a href="http://www.nanocon.cz" target="_blank" >http://www.nanocon.cz</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Electrically Conductive Adhesive with Micro-Nano Filter
Original language description
Properties of electrically conductive adhesive with bis-phenol epoxy matrix and silver micro-nano filler were examined. It was found that addition of silver nano-particles into standard adhesive filled with silver micro-flakes does not improve its electrical properties.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
NANOCON 2011 Conference Proceedings
ISBN
978-80-87294-23-9
ISSN
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e-ISSN
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Number of pages
1
Pages from-to
38
Publisher name
TANGER, spol.s r.o.
Place of publication
Ostrava
Event location
Brno
Event date
Sep 21, 2011
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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