Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F08%3A00147154" target="_blank" >RIV/68407700:21230/08:00147154 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
Original language description
The paper describes the use of Failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. Wettability of joined parts on the type of solder and surface finish of connected parts has been investigated.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2008
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
31st International Spring Seminar on Electronics Technology
ISBN
978-1-4244-3973-7
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
IEEE
Place of publication
New York
Event location
Budapest
Event date
May 7, 2008
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000272337900082