Tin Whiskers - Reliability Risk For Electronic Equipment

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F09%3A00157761" target="_blank" >RIV/68407700:21230/09:00157761 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Tin Whiskers - Reliability Risk For Electronic Equipment
Original language description
Unalloyed tin electroplating has a long history of whisker formation that has resulted in reliability risks for electronic equipment. Tin whiskers can grow between adjacent conductors of different potential, causing transient or permanent electrical shorts. In addition, the whiskers can break loose, causing mechanical damage in slip rings, optical components or MEMS. Legislation restriction of lead in electronic products sold in the European Union and many other areas of the world has resulted in removing lead from Sn/Pb plating and solder. Using pure tin represents reliability risks due to whisker forming tendencies of tin. The objective of our work is to investigate methods for whisker growth, which can further enable measuring the effectiveness of mitigation strategies. To achieve this objective, a set of experiments was conducted using bright and matte tin platings on brass and bronze coupons and hot-solder dipped bronze coupons.
Czech name
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Czech description
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Project
<a href="/en/project/OE229" target="_blank" >OE229: Bestproduct -Teeneest Through a European network on Environmental Engineering Sciences and Technologies</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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