Whisker Formation - Reliability Risk for Telecomunication Application

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00181119" target="_blank" >RIV/68407700:21230/11:00181119 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Whisker Formation - Reliability Risk for Telecomunication Application
Original language description
Tin whiskers are electrically conductive filaments that spontaneously grow on tin surfaces. The risk of whiskers does not present a big issue for consumer industry with shorter product`s lifecycle. On the other hand, due to the high reliability requirements of industrial applications such as telecommunication, whiskers have started to play the key role. This paper presents results of a case study, where the whisker formation was studied in detail on telecommunications equipment. The other part of this paper presents the results of experiments focused on the investigation of a method for a whisker. Methods for accelerated whisker growth are necessary for measuring the effectiveness of mitigation strategies. To achieve this, a set of experiments was conducted using tin platings on brass and bronze coupons and hot solder dipped bronze coupons. The experiments thus have shown the significant reliability risk for the devices containing pure tin platings layers and lead-free solders.
Czech name
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Czech description
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Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Electronic Devices and Systems, IMAPS CS International Conference 2011 Proceedings
ISBN
978-80-214-4303-7
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
33-38
Publisher name
VUT v Brně, FEKT
Place of publication
Brno
Event location
Brno
Event date
Jun 22, 2011
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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