Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F09%3A00159455" target="_blank" >RIV/68407700:21230/09:00159455 - isvavai.cz</a>
Result on the web
<a href="http://www.imaps.cz/eds2009/" target="_blank" >http://www.imaps.cz/eds2009/</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Influence oh the Temperature Profile on the Mechanical Stressed Soldered Joints
Original language description
In this article, the changes of the electrical resistance of mechanically stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) against reflow temperature profiles are compared.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronic Devices and Systems, IMAPS CS International Conference 2009 Proceedings
ISBN
978-80-214-3933-7
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
266-270
Publisher name
VUT v Brně, FEI
Place of publication
Brno
Event location
Brno
Event date
Sep 2, 2009
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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