Intermetallic Compounds in Soldering
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F09%3A00165539" target="_blank" >RIV/68407700:21230/09:00165539 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Intermetallic Compounds in Soldering
Original language description
The intermetallic compounds formed in soldered joints are one of main factors influencing the quality of bond between the soldering pad and solder. They also influence lifetime of electronic devices and components, as well as repairs and replacements ofdefective devices. The intermetallics are also very serious factor in connection with mechanical stress and fatigue, especially if cracks are forming in soldered joints.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů