Solderability Measurement of Copper with Different Surface Finishes
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F10%3A00171627" target="_blank" >RIV/68407700:21230/10:00171627 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=5547267&queryText%3DSolderability+Measurement+of+Copper+with+Dif" target="_blank" >http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=5547267&queryText%3DSolderability+Measurement+of+Copper+with+Dif</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2010.5547267" target="_blank" >10.1109/ISSE.2010.5547267</a>
Alternative languages
Result language
angličtina
Original language name
Solderability Measurement of Copper with Different Surface Finishes
Original language description
This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders (Sn63Pb37, Sn95,5Ag3,8Cu0,7), two types of fluxes (94-RXZM (IPC-ANCI-J-STD-004 - REL0), 323-ITV (C-ANCI-J-STD-004 - REL1)) and as testing material we used one-side plating PCB (FR4) with four types of surface finishes (pasivated copper, H.A.L, immersion tin, chemical gold plating). Forthe measurement we have used one of the commonly used wettability evaluation methods - wetting balance (meniscograph) method. We marked the wettability, according to the shape of wetting curve, for each testing combination and sorted them into the table.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
33rd International Spring Seminar on Electronics Technology
ISBN
978-1-4244-7849-1
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
113-116
Publisher name
IEEE
Place of publication
New York
Event location
Warsaw
Event date
May 12, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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