Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00182186" target="_blank" >RIV/68407700:21230/11:00182186 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile
Original language description
Electrically Conductive Adhesives (ECAs) are spreading the electronic industry, often deployed in adverse climatic conditions. A series of accelerated climatic experiments was undertaken to gather more information about this technology and its environmental stability. During these tests, an interesting behavior of the two-component ECAs was observed: a sharp drop of electrical resistance in a short time after the curing of the ECA. This indicated a possible problem with the stability of two-component ECAs and mandated further research. Its results are published in this paper and seem to support the validity of the original finding - that there exists a possible risk when using certain conductive adhesives and that manufacturer-supplied curing temperature profiles might, in some cases, be insufficient.
Czech name
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Czech description
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Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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