Combined Accelerated Climatic Tests Of Electrically Conductive Adhesive

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F10%3A00169421" target="_blank" >RIV/68407700:21230/10:00169421 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Combined Accelerated Climatic Tests Of Electrically Conductive Adhesive
Original language description
Electrically Conductive Adhesives has already been used in the electronics industry for 30 years. In recent years, electrically conductive adhesive plays more and more important roles in industry, especially for its advantages of low curing temperature and environmental. Their applications vary, but mostly include various heat-sensitive devices or devices with fine lead pitch, such as LCD and LED screens. With increased use of ECAs these devices are being used even in harsh environment, such as laptop computers or various displays used in the automotive industry. Accelerated reliability tests have been focused on aspects of the assembly process on a test PCB using one-component and two-component ECAs and their reliability parameters during combined climatic test. The experimental results show that the properties such as electrical resistance as well as the shear strength of electrically conductive adhesive were evidently affected by the temperature and the time during dry heat test.
Czech name
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Czech description
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Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Electronic Devices and Systems, IMAPS CS International Conference 2010 Proceedings
ISBN
978-80-214-4138-5
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
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Publisher name
VUT v Brně, FEI
Place of publication
Brno
Event location
Brno
Event date
Sep 1, 2010
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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