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Synergy Effect of Failure Mode and Effect Analysis and Fault Tree Analysis for Adhesive Joining Optimization

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00185187" target="_blank" >RIV/68407700:21230/11:00185187 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Synergy Effect of Failure Mode and Effect Analysis and Fault Tree Analysis for Adhesive Joining Optimization

  • Original language description

    The paper introduces formulation of appropriate risk estimation methods and procedures that can be used for improvement of a production processes in electronics area. Two methods for risk assessment were chosen with regard to the specifics of adhesive joining based on electrically conductive adhesives. The paper provides an implementation of step-by-step risk analysis procedure using a FMEA, and FTA methods for optimization of this process. Typical features and failures of the process were identified using failure mode and effect analysis, as the first tool. Critical operations were found and actions, how to avoid failures in these actions, were proposed. The results of failure mode and effect analysis were used for construction of a fault-tree model.All main differences between failure mode and effect analysis and fault tree analysis were defined and it was sorted out how to use both techniques complementing each other for synergy achievement and getting more efficient results.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2011

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    InterTech 2011

  • ISBN

    978-83-926896-3-8

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    126-130

  • Publisher name

    Poznan University of Technology

  • Place of publication

    Poznaň

  • Event location

    Poznan

  • Event date

    May 18, 2011

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article