Synergy Effect of Failure Mode and Effect Analysis and Fault Tree Analysis for Adhesive Joining Optimization
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00185187" target="_blank" >RIV/68407700:21230/11:00185187 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Synergy Effect of Failure Mode and Effect Analysis and Fault Tree Analysis for Adhesive Joining Optimization
Original language description
The paper introduces formulation of appropriate risk estimation methods and procedures that can be used for improvement of a production processes in electronics area. Two methods for risk assessment were chosen with regard to the specifics of adhesive joining based on electrically conductive adhesives. The paper provides an implementation of step-by-step risk analysis procedure using a FMEA, and FTA methods for optimization of this process. Typical features and failures of the process were identified using failure mode and effect analysis, as the first tool. Critical operations were found and actions, how to avoid failures in these actions, were proposed. The results of failure mode and effect analysis were used for construction of a fault-tree model.All main differences between failure mode and effect analysis and fault tree analysis were defined and it was sorted out how to use both techniques complementing each other for synergy achievement and getting more efficient results.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
InterTech 2011
ISBN
978-83-926896-3-8
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
126-130
Publisher name
Poznan University of Technology
Place of publication
Poznaň
Event location
Poznan
Event date
May 18, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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