FMEA and FTA Analyses of the Adhesive Joining Process using Electrically Conductive Adhesives
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00194229" target="_blank" >RIV/68407700:21230/12:00194229 - isvavai.cz</a>
Result on the web
<a href="http://ctn.cvut.cz/ap/index.php?year=2012&idissue=79" target="_blank" >http://ctn.cvut.cz/ap/index.php?year=2012&idissue=79</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
FMEA and FTA Analyses of the Adhesive Joining Process using Electrically Conductive Adhesives
Original language description
This paper introduces a formulation of appropriate risk estimation methods that can be used for improving of processes in the electronics area. Two risk assessment methods have been chosen with regard to the specifics of adhesive joining based on electrically conductive dhesives. The paper provides a combination of a failure mode and effect analysis (FMEA) and fault tree analysis (FTA) for optimizing of the joining process.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Acta Polytechnica
ISSN
1210-2709
e-ISSN
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Volume of the periodical
52
Issue of the periodical within the volume
2
Country of publishing house
CZ - CZECH REPUBLIC
Number of pages
8
Pages from-to
48-55
UT code for WoS article
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EID of the result in the Scopus database
2-s2.0-84860686761