Pressure Sensor Package Simulation in Large Temperature Range

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00198667" target="_blank" >RIV/68407700:21230/12:00198667 - isvavai.cz</a>
Result on the web
<a href="http://www.imaps.cz/eds/" target="_blank" >http://www.imaps.cz/eds/</a>
DOI - Digital Object Identifier
—

Result language
angličtina
Original language name
Pressure Sensor Package Simulation in Large Temperature Range
Original language description
Modeling and results of thermal cycling measurement of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed bysintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961 °C). It has shownoperational in temperature cycling above 600 °C for more than 1800 hours. Modeling of the package shows that the stresses in the electrical interconnections are close to the yield stress of silver at 20 °C. The stress free temperature for simulation wasset to 850 °C. Temperature induced stress and strains in the packaging and a fatigue simulation are performed. The package is generic and can be converted to fit most geometries and high temperature applications.
Czech name
—
Czech description
—

Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of Electronic Devices and Systems EDS 2012
ISBN
978-80-214-4539-0
ISSN
—
e-ISSN
—
Number of pages
6
Pages from-to
132-137
Publisher name
VUT v Brně, FEKT
Place of publication
Brno
Event location
Brno
Event date
Jun 28, 2012
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
—

Similar results(10)