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The analysis of reliability of solder joints on SMD ceramic resistor arrays

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F17%3APU124340" target="_blank" >RIV/00216305:26220/17:PU124340 - isvavai.cz</a>

  • Result on the web

    <a href="https://www.scopus.com/record/display.uri?eid=2-s2.0-85029894081&origin=resultslist&sort=plf-f&src=s&st1=Three+ways+to+ceramic+packages&st2=&sid=534787b9a245c56e0a007da102eef45d&sot=b&sdt=b&sl=45&s=TITLE-ABS-KEY%28Three+ways+to+ceramic+packages%29&relpos" target="_blank" >https://www.scopus.com/record/display.uri?eid=2-s2.0-85029894081&origin=resultslist&sort=plf-f&src=s&st1=Three+ways+to+ceramic+packages&st2=&sid=534787b9a245c56e0a007da102eef45d&sot=b&sdt=b&sl=45&s=TITLE-ABS-KEY%28Three+ways+to+ceramic+packages%29&relpos</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE.2017.8000939" target="_blank" >10.1109/ISSE.2017.8000939</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    The analysis of reliability of solder joints on SMD ceramic resistor arrays

  • Original language description

    Abstract This paper deals with the area of solder joints reliability and narrower focus is on solder joints on SMD ceramic resistor arrays in configuration 8x0603. These SMD ceramic resistor arrays are soldered on 30 testing boards and every board includes two packages. Testing boards are exposed to influences of temperature changes in the temperature chamber. The range of temperature changes is from -25 °C to 120 °C with 15 minutes time dwell on minimal and maximal temperature. Each SMD ceramic package includes eight independent resistors with zero resistance and there is monitored the conductive connection between each pair of solder joints on each resistor. The main aim is to trace reliability of solder joints depending on the location of solder joints on SMD ceramic package. There is an assumption that the highest reliability of solder joints is in the centre of the package and decreases towards corners of the package. The next section shows computer simulations of testing boards, SMD ceramic packages and solder joints on them. The prerequisite for simulations is to achieve similar conditions such as during temperature cycling in the chamber. This includes same temperature conditions as in the case of the practical experiment and using the model which is close to real SMD ceramic resistor array. The results from the practical experiment are complemented by simulations in ANSYS.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2017

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Electronics Technology (ISSE), 2017 40th International Spring Seminar

  • ISBN

    978-1-5386-0582-0

  • ISSN

    2161-2528

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    240-245

  • Publisher name

    IEEE Computer Society

  • Place of publication

    Sofia, Bulgaria

  • Event location

    Sofia

  • Event date

    May 10, 2017

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000426973000062