The Analysis of Ceramic Resistor Arrays in SMT

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F17%3APU124636" target="_blank" >RIV/00216305:26220/17:PU124636 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
The Analysis of Ceramic Resistor Arrays in SMT
Original language description
This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring physical phenomenas by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation reliability of solder joints on specific microelectronicc part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boardss under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chodsen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.
Czech name
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Czech description
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Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 23rd Conference STUDENT EEICT 2017
ISBN
978-80-214-5496-5
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
550-554
Publisher name
Neuveden
Place of publication
Neuveden
Event location
Brno
Event date
Apr 27, 2017
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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