Influence of nanoparticle additives on change of the glass transition temperature of electrically conductive adhesives

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00210712" target="_blank" >RIV/68407700:21230/13:00210712 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Influence of nanoparticle additives on change of the glass transition temperature of electrically conductive adhesives

Original language description

After elimination of lead from soft solders used for the electrical industry had to find new alternatives for creating electrically conductive connections. For some time no, one of the widespread options is using lead-free solders. Also another alternative comes to the fore. This alternative is using electrically conductive adhesives. The quality of their electrical and mechanical properties far does not reach the quality of lead-free solders. And therefore they are used only on places where is necessary.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2013

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Electric Power Engineering 2013

ISBN

978-80-248-2988-3

ISSN

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e-ISSN

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Number of pages

3

Pages from-to

305-307

Publisher name

VŠB - Technical University of Ostrava

Place of publication

Ostrava

Event location

Kouty nad Desnou

Event date

May 28, 2013

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

000321920400057