Whiskers Growth on Thick Tin Layers and Various Types of Surfaces
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00221826" target="_blank" >RIV/68407700:21230/14:00221826 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887591&isnumber=6887550" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887591&isnumber=6887550</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887591" target="_blank" >10.1109/ISSE.2014.6887591</a>
Alternative languages
Result language
angličtina
Original language name
Whiskers Growth on Thick Tin Layers and Various Types of Surfaces
Original language description
The transition from a highly widespread lead solders to lead-free solder alloy types meant many changes in the electrical industry. This transition has brought many technological phenomena that deserve our attention and they have to be still addressed inorder to improve the quality and reliability of manufacturing printed circuit boards. One of them is the presence of small crystalline formations on the surfaces of tin and some tin alloys which are called whiskers. This article focuses on the influenceof the used electrical materials and their surface treatments on the growth of tin whiskers. For our experiment were selected two lead-free solders with a high percentage representation of tin, by which are Sn95,5Ag3,8Cu0,7 (SAC 387) and Sn99Cu1. Solders were plated in a thick layer on the three types of metal substrates with various surface finishes. For this experiment was chosen copper, brass and phosphor bronze. The created samples were exposed to static mechanical stresses of compr
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
37th Int. Spring Seminar on Electronics Technology
ISBN
978-1-4799-4455-2
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
193-197
Publisher name
IEEE
Place of publication
New York
Event location
Drážďany
Event date
May 7, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000346580500039