Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00349981" target="_blank" >RIV/68407700:21230/21:00349981 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE51996.2021.9467629" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467629</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467629" target="_blank" >10.1109/ISSE51996.2021.9467629</a>
Alternative languages
Result language
angličtina
Original language name
Influence of Stress Factors on the Whiskers Growth on Sn-Cu Based Surfaces
Original language description
One of the hardly predictable issuesin the case of solder joints are tin whiskers. Tin whiskers are electrically conductive crystals that spontaneously grow on a surface.This article deals with tin whiskers growth on the three types of metallization (pure tin, SnCu1 and SnCu3 solder alloy) of the copper substrate. Two stressing factors were considered in the experiment –temperature ageing (three temperature conditions were chosen: 20 °C, 50 °C and 80 °C) and mechanical stress via bend of wire before and after the soldering process. The incidence ofwhiskers on the surfaces was observed by confocal microscopy. The results show that the major influence on whiskers incidence has two factors, mechanical stress followed by the influence of temperature. Whereas the other factor –copper content in used materials showed a minor influence on whiskers incidence.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2021 44th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-1477-7
ISSN
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e-ISSN
2161-2528
Number of pages
5
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Bautzen
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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