Flux effect on void quantity and size in soldered joints

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00301367" target="_blank" >RIV/68407700:21230/16:00301367 - isvavai.cz</a>
Alternative codes found
RIV/00216305:26220/16:PU122004
Result on the web
<a href="http://dx.doi.org/10.1016/j.microrel.2016.03.009" target="_blank" >http://dx.doi.org/10.1016/j.microrel.2016.03.009</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.microrel.2016.03.009" target="_blank" >10.1016/j.microrel.2016.03.009</a>

Result language
angličtina
Original language name
Flux effect on void quantity and size in soldered joints
Original language description
This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes were used, three were gel based (NC559, MTV-125R, TSF-6516) and two of them were liquid based (Topnik G-5, JBC FL-15). They were used within two solder pastes, both lead and lead-free. The reflow process was identical for all of the combinations and was within the range of manufacturer recommended profiles. The amount of voids was evaluated using X-ray analysis. It was found that the use of increased amount of proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrence.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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