Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00317630" target="_blank" >RIV/68407700:21230/17:00317630 - isvavai.cz</a>

Result on the web

<a href="http://dx.doi.org/10.1108/SSMT-10-2016-0022" target="_blank" >http://dx.doi.org/10.1108/SSMT-10-2016-0022</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/SSMT-10-2016-0022" target="_blank" >10.1108/SSMT-10-2016-0022</a>

Result language

angličtina

Original language name

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Original language description

Purpose - A measurement method has been developed to reveal the viscosity change of solder pastes during stencil printing. This paper aimed to investigate thixotropic behaviour, the viscosity change of a lead-free solder paste (Type 4). Design/methodology/approach - The viscosity change of the solder paste during stencil printing cycles was characterised in such a way that the time-gap between the printing cycles was modelled with a rest period between every rheological measurement. This period was set as 15, 30 and 60 s during the research. The Cross model was fitted to the measurement results, and the eta(o) parameter was used to characterise the viscosity change. The number of printing cycles necessary for reaching a stationary state in viscosity was determined for various rest periods. Findings - It was found that the decrease in zero-shear viscosity is significant (25 per cent) in the first cycles, and it starts to become stationary at the sixth-seventh cycles. This means a printing process can provide the appropriate deposits only after the 7th cycle with the investigated Type 4 solder paste. Originality/value - Time-dependent rheological behaviour of solder pastes was studied in the literature, but only the viscosity change over continuous time at constant shear rates was examined. The time-gap between stencil printing cycles was not considered, and thixotropic behaviour of solder pastes was also neglected. Therefore, the authors developed a measurement set which is able to model the effect of time-gap between printing cycles on the viscosity change of solder pastes.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Publication year

2017

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Soldering & Surface Mount Technology

ISSN

0954-0911

e-ISSN

1758-6836

Volume of the periodical

29

Issue of the periodical within the volume

1

Country of publishing house

GB - UNITED KINGDOM

Number of pages

5

Pages from-to

10-14

UT code for WoS article

000396464600003

EID of the result in the Scopus database

2-s2.0-85011079244