Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00344951" target="_blank" >RIV/68407700:21230/20:00344951 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1108/SSMT-11-2019-0037" target="_blank" >https://doi.org/10.1108/SSMT-11-2019-0037</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/SSMT-11-2019-0037" target="_blank" >10.1108/SSMT-11-2019-0037</a>

Result language

angličtina

Original language name

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Original language description

Purpose The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma'aiteh) and different printing speeds on the numerical results (e.g. pressure over stencil) of a numerical model regarding stencil printing. Design/methodology/approach A finite volume model was established for describing the printing process. Two types of viscosity models for non-Newtonian fluid properties were compared. The Cross model was fitted to the measurement results in the initial state of a lead-free solder paste, and the parameters of a Al-Ma'aiteh material model were fitted in the stabilised state of the same paste. Four different printing speeds were also investigated from 20 to 200 mm/s. Findings Noteworthy differences were found in the pressure between utilising the Cross model and the Al-Ma'aiteh viscosity model. The difference in pressure reached 33-34% for both printing speeds of 20 and 70 mm/s and reached 31% and 27% for the printing speed of 120 and 200 mm/s. The variation in the difference was explained by the increase in the rates of shear by increasing printing speeds. Originality/value Parameters of viscosity model should be determined for the stabilised state of the solder paste. Neglecting the thixotropic paste nature in the modelling of printing can cause a calculation error of even approximately 30%. By using the Al-Ma'aiteh viscosity model over the stabilised state of solder pastes can provide more accurate results in the modelling of printing, which is necessary for the effective optimisation of this process, and for eliminating soldering failures in highly integrated electronic devices.

Czech name

—

Czech description

—

Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2020

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Soldering & Surface Mount Technology

ISSN

0954-0911

e-ISSN

1758-6836

Volume of the periodical

32

Issue of the periodical within the volume

4

Country of publishing house

GB - UNITED KINGDOM

Number of pages

5

Pages from-to

219-223

UT code for WoS article

000547273900001

EID of the result in the Scopus database

2-s2.0-85087115974