Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F18%3A00325955" target="_blank" >RIV/68407700:21230/18:00325955 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1108/SSMT-09-2017-0025" target="_blank" >http://dx.doi.org/10.1108/SSMT-09-2017-0025</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1108/SSMT-09-2017-0025" target="_blank" >10.1108/SSMT-09-2017-0025</a>

Result language
angličtina
Original language name
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
Original language description
Purpose The vacuum vapour phase soldering method was investigated by numerical simulations. The purpose of this study was to examine the temperature changes of the solder joints during the vapour suctioning process. A low pressure is used to enhance the outgassing of the trapped gas within the solder joints, which otherwise could form voids. However, the system loses heat near the suction pipe during the suctioning process, and it can result in preliminary solidification of the solder joints before the gas could escape.
Czech name
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Czech description
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Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering

Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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