Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00341387" target="_blank" >RIV/68407700:21230/20:00341387 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1108/SSMT-11-2019-0038" target="_blank" >https://doi.org/10.1108/SSMT-11-2019-0038</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1108/SSMT-11-2019-0038" target="_blank" >10.1108/SSMT-11-2019-0038</a>
Alternative languages
Result language
angličtina
Original language name
Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces
Original language description
Purpose: The paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed Circuit Board (PCB) surfaces. The investigation can help develop a better understanding of the process and provide information for future modelling of the process. Design/methodology/approach: For the investigations, flame retardant grade 4 (FR4) PCB plates and sealed plate–based boxes were immersed into saturated vapour of an experimental oven. The temperature and resulting heat transfer coefficients were analysed according to the sample boxes and the surface orientations. In addition, the boxes’ vapour consumption was investigated with pressure measurements. Findings: The horizontal top- and bottom-side heating shows very similar results. In addition, the sides of a box were heated in a manner similar to the top and the bottom sides, but there was a slight increase in the heat transfer coefficient because of the vertical wall alignment. The pressure measurements reveal the dynamic changes in vapour after immersion of the boxes. Practical implications: The findings may help to show differences on different surface orientations, pointing to more precise, explicit and multiphysics simulation results. Originality/value: The experiments present an aspect of heat transfer coefficient differences in VPS ovens, also highlighting the effect of initial pressure drop inside the workspace of an oven.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
10302 - Condensed matter physics (including formerly solid state physics, supercond.)
Result continuities
Project
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Continuities
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Others
Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Soldering & Surface Mount Technology
ISSN
0954-0911
e-ISSN
1758-6836
Volume of the periodical
32
Issue of the periodical within the volume
4
Country of publishing house
GB - UNITED KINGDOM
Number of pages
6
Pages from-to
247-252
UT code for WoS article
000524479600001
EID of the result in the Scopus database
2-s2.0-85083058647