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Climatic Aging of Conductive Adhesive Joints on Pads with Different Surface Finishes

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00356341" target="_blank" >RIV/68407700:21230/21:00356341 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1109/SIITME53254.2021.9663676" target="_blank" >https://doi.org/10.1109/SIITME53254.2021.9663676</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/SIITME53254.2021.9663676" target="_blank" >10.1109/SIITME53254.2021.9663676</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Climatic Aging of Conductive Adhesive Joints on Pads with Different Surface Finishes

  • Original language description

    Adhesive joints formed from four types of electrically conductive adhesives based on an insulating matrix from the bis-phenol epoxy matrix and silver filler have been aged at the combined temperature-humidity climate. Four combinations of these parameters have been used for climatic treatment: 25 °C and 50 % or 85 % RH, 85 °C and 50 % or 85 % RH. The total time of aging is 400 hours. It has been found that the combination of increased temperature and increased humidity causes the fastest increase of joint resistance.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20505 - Composites (including laminates, reinforced plastics, cermets, combined natural and synthetic fibre fabrics; filled composites)

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2021

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

  • ISBN

    978-1-6654-2110-2

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    156-159

  • Publisher name

    IEEE Press

  • Place of publication

    New York

  • Event location

    Timisoara

  • Event date

    Oct 25, 2021

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000786441900037