Temperature Dependence of the Resistance of Adhesive Conductive Joins and Thermal Expansion of Conductive Adhesives
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00371942" target="_blank" >RIV/68407700:21230/23:00371942 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE57496.2023.10168360" target="_blank" >https://doi.org/10.1109/ISSE57496.2023.10168360</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168360" target="_blank" >10.1109/ISSE57496.2023.10168360</a>
Alternative languages
Result language
angličtina
Original language name
Temperature Dependence of the Resistance of Adhesive Conductive Joins and Thermal Expansion of Conductive Adhesives
Original language description
The temperature dependence of the resistance of adhesive conductive joints and the thermal coefficient of longitudinal expansion of conductive adhesives were examined. . The adhesive was applied by stencil printing. The resistance of the joints was measured by the four-point method and the thermal expansion of used adhesives was measured by the thermomechanical analysis technique. The junction resistance was found to increase approximately linearly with temperature. . It was also found that the coefficient of thermal longitudinal expansion varies depending on the adhesive and also on the sample when all samples are made from the same adhesive.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2023 46th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-3485-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
4
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Temešvár
Event date
May 10, 2023
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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