Effect of Temperature Shocks on the Resistance of Joints Formed of Conductive Adhesives

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00371936" target="_blank" >RIV/68407700:21230/23:00371936 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE57496.2023.10168314" target="_blank" >https://doi.org/10.1109/ISSE57496.2023.10168314</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168314" target="_blank" >10.1109/ISSE57496.2023.10168314</a>

Result language
angličtina
Original language name
Effect of Temperature Shocks on the Resistance of Joints Formed of Conductive Adhesives
Original language description
Conductive adhesive joints were climatically aged with temperature pulses in the range of -40 to 115 oC. The joints were made of two types of electrically conductive adhesives. The joints were first exposed for 15 minutes in the hot chamber of the thermal pulse testing device, then moved within 8 seconds to the cold chamber and exposed again for 15 minutes. This cycle was repeated two hundred times and five hundred times. The connection resistance was measured using the four-point method. Exposure to temperature pulses was found to cause small changes only in junction resistance.
Czech name
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Czech description
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Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2023 46th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-3485-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
4
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Temešvár
Event date
May 10, 2023
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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