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Influence of temperature shocks on climatic aging of conductive adhesive joints

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338482" target="_blank" >RIV/68407700:21230/19:00338482 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1109/ISSE.2019.8810175" target="_blank" >https://doi.org/10.1109/ISSE.2019.8810175</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE.2019.8810175" target="_blank" >10.1109/ISSE.2019.8810175</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Influence of temperature shocks on climatic aging of conductive adhesive joints

  • Original language description

    Conductive joints formed from electrically conductive adhesives with isotropic electrical conductivity were aged using temperature shocks. The joints were exposed by 10 or 40 shocks -40/+80 oC. The exposure time of the samples at each temperature was 15 minutes; the time of the temperature change did not exceed 10 seconds. Then the joints were climatic treated at 80 oC/80 % relative humidity for 168 and 336 hours, respectively. It was found a small influence of the shocks on the resistance and climatic aging of the joints.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20501 - Materials engineering

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2019

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2019 42nd International Spring Seminar on Electronics Technology (ISSE)

  • ISBN

    978-1-7281-1874-1

  • ISSN

    2161-2528

  • e-ISSN

    2161-2536

  • Number of pages

    4

  • Pages from-to

    297-300

  • Publisher name

    IEEE Press

  • Place of publication

    New York

  • Event location

    Wroclaw

  • Event date

    May 15, 2019

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000507501000007