Effect of Fe and Bi Additives on Electrochemical Migration Behavior of SAC105

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00386746" target="_blank" >RIV/68407700:21230/25:00386746 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE65583.2025.11121063" target="_blank" >https://doi.org/10.1109/ISSE65583.2025.11121063</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11121063" target="_blank" >10.1109/ISSE65583.2025.11121063</a>

Result language
angličtina
Original language name
Effect of Fe and Bi Additives on Electrochemical Migration Behavior of SAC105
Original language description
This study investigates the electrochemical migration (ECM) behavior of novel SAC105-based solder alloys with varying Fe and Bi contents (0.05 Fe 2 Bi, 0.1 Fe 2 Bi, 0.1 Fe 1 Bi) in comparison to SAC105 without additives. The evaluation was conducted using a water drop test with a 1 mM NaCl electrolyte under an applied voltage of 3 V to determine the time to failure (TTF). Electrode surface, dendrite formations, and precipitates were characterized through scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The ECM behaviors were then compared to the corrosion properties determined using a polarization test. The results indicate that the SAC105 alloy without additives exhibited the shortest TTF, and the incorporation of Fe and Bi additives enhanced ECM resistance, with the 0.1 Fe 1 Bi alloy demonstrating the highest TTF. However, EDX analysis reveals that there is no iron or bismuth in the dendrites; only tin was observed to deposit at the cathode. The polarization test revealed an opposite outcome, as the 0.1 Fe 1 Bi alloy showed the lowest corrosion resistance. The findings underscore the necessity to contemplate both mechanisms in order to ensure the reliability of solder alloys.
Czech name
—
Czech description
—

Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2025 International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3315-1217-0
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
5
Pages from-to
—
Publisher name
Institute of Electrical and Electronics Engineers
Place of publication
New York
Event location
Budapešť
Event date
May 14, 2025
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001585293500094

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