Electrochemical Migration Resistance of Gold Surface Finishes
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00376643" target="_blank" >RIV/68407700:21230/24:00376643 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE61612.2024.10604108" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10604108</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604108" target="_blank" >10.1109/ISSE61612.2024.10604108</a>
Alternative languages
Result language
angličtina
Original language name
Electrochemical Migration Resistance of Gold Surface Finishes
Original language description
So far, only a few studies have been focused on the electrochemical migration (ECM) of gold or gold surface finishes of printed circuit boards. Therefore, this work focused on the evaluation and comparison of electroless nickel immersion gold (ENIG) and galvanic gold in terms of ECM. The copper surface was also included in the experiment as a reference value. The water drop test (WDT) was conducted with distilled water on the comb pattern electrodes with three different applied voltages, and time to failure (TTF) was measured. Energy Dispersive X-ray (EDX) analysis of the dendrites was subsequently performed regarding their composition. The results showed an apparent difference in ECM behavior between the gold surface finishes. ENIG surface finish is more resistant to ECM than galvanic gold. Bare copper is the most susceptible to ECM among tested surface finishes. The difference in susceptibility to ECM among gold surface finishes is caused by their structure and how they cover the copper electrodes.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2024 47th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-8548-9
ISSN
2161-2536
e-ISSN
—
Number of pages
5
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Praha
Event date
May 15, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001283808200068