Comparison of Gold-Plated PCB Finishes

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00342442" target="_blank" >RIV/68407700:21230/20:00342442 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE49702.2020.9121062" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9121062</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121062" target="_blank" >10.1109/ISSE49702.2020.9121062</a>

Result language
angličtina
Original language name
Comparison of Gold-Plated PCB Finishes
Original language description
In this work, two surface finishes - Electroless Nickel Immersion Gold (ENIG) and Galvanic Gold were compared. Solder joints were tested with respect to used materials (ENIG and Galvanic Gold finishes, lead-free solders SAC305 M8, SAC305 NC257-2), used technologies (heating factor of 218 s°C and 2295 s°C). The resistance of soldered joints was measured on prepared samples. The measurement results showed the influence of the heating factor on the resistance of soldered joints. With a heating factor of 218 s°C, the resistance of the joint is higher than that of a soldered joint realized using a higher heating factor, except for samples with a galvanic coating. A destructive shear strength test was also conducted. The results showed that heating factor may affect reliability of the soldered joint as the shear strength is influenced. In the case of SAC305 M8 solder, the shear strength values of the soldered joints with heating factor of 2295 s°C are approximately 21% higher, with the exception of the sample with half thickness of the standard thickness of ENIG surface finish. The SAC305 NC257-2 solder does not have big differences in shear strength at lower and higher heating factors during reflow.
Czech name
—
Czech description
—

Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2020 43rd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-6773-2
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
5
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Demanovska Valley
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000610543500054

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