Comparison of Gold-Plated PCB Finishes after Thermal Stress
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00350943" target="_blank" >RIV/68407700:21230/21:00350943 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE51996.2021.9467593" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467593</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467593" target="_blank" >10.1109/ISSE51996.2021.9467593</a>
Alternative languages
Result language
angličtina
Original language name
Comparison of Gold-Plated PCB Finishes after Thermal Stress
Original language description
The article deals with thermal cycling influence on the electrical and mechanical properties of the soldered joint on various gold-plated surfaces. The purpose was to determine the effect of thermal aging on the properties of the soldered joint of Galvanic Gold and Electroless Nickel Immersion Gold (ENIG) surface finishes and two lead-free solder alloys SAC305 NC257-2 and SAC305 M8. Two different heating factors of limit values - minimum value of 218 s°C at which the solder is still possible to reflow and a maximum value of 2295 s°C which still fits to the manufacturer's specifications - were used for reflow process of used solders. Prepared samples were thermally cycled in a shock test chamber (-40°C, +125°C) or aged at 85°C and 85% RH (HH, Heat-Humidity chamber). The results show the influence of shock temperatures on the shear strength and resistance of soldered joints. The shear strength decreased after 1000 thermal cycles by 40% and soldered joints reflowed with a higher heating factor were stronger than the soldered joints reflowed with a lower heating factor. In contrast to shock temperatures, HH test did not have a significant effect on shear strength.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2021 44th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-1477-7
ISSN
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e-ISSN
2161-2528
Number of pages
5
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Bautzen
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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