Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00367199" target="_blank" >RIV/68407700:21230/23:00367199 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE57496.2023.10168367" target="_blank" >https://doi.org/10.1109/ISSE57496.2023.10168367</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168367" target="_blank" >10.1109/ISSE57496.2023.10168367</a>

Result language
angličtina
Original language name
Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration
Original language description
This work aimed to investigate the susceptibility of novel nanocomposite solder paste to electrochemical migration (ECM). Bismuth-tin solder paste was filled with 0.1 wt.% of TiO2 nanoparticles. The electrochemical migration behavior was evaluated using a water drop (WD) test. High-purity water and 10 VDC bias voltage were applied. The experiments were performed on two types of samples differing in the surface finish of conductive pattern- bare copper without surface protection and copper with applied galvanic gold finish. The results revealed a trend when the mean time to failure decreased for samples with deposited nanocomposite solder paste, regardless of the surface finish. Thus, the electronics’ reliability may be lowered when using Bi-Sn paste doped with TiO2 nanoparticles, at least in terms of ECM. This deterioration of the solder paste should be considered a significant drawback for further development. However, the nanoparticles could improve other properties related to modified microstructure, such as mechanical or thermal. These aspects will be the subject of further research.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF16_028%2F0006215" target="_blank" >EF16_028/0006215: Development of capacity for strategic research management at CTU in Prague</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2023 46th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-3484-5
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Temešvár
Event date
May 10, 2023
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—

Similar results(10)