Electrochemical Migration Issues Related to Improper Solder Mask Application
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358706" target="_blank" >RIV/68407700:21230/22:00358706 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE54558.2022.9812811" target="_blank" >https://doi.org/10.1109/ISSE54558.2022.9812811</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812811" target="_blank" >10.1109/ISSE54558.2022.9812811</a>
Alternative languages
Result language
angličtina
Original language name
Electrochemical Migration Issues Related to Improper Solder Mask Application
Original language description
This work aimed to analyze a reliability issue that occurred on printed circuit boards (PCB) primarily designed to study electrochemical migration (ECM) phenomena. The test boards were supplied directly from the PCB producer, and the copper traces were covered with a hot air solder leveling (HASL) surface finish. However, the solder layer was clearly inconsistent and poor, caused by contamination from improper solder mask application, as was confirmed by analysis using the scanning electron microscope. On these boards, a water drop test with distilled water (bias voltage of 10 V) and thermal humidity bias test (85 °C/90% R.H./25 V/168 h) was conducted to evaluate predisposition for electrochemical migration of boards with a such poorly fabricated solder mask. PCB without solder mask and with correctly applied solder mask was also included in this study for comparison. The results clearly showed that the test boards with the poorly fabricated solder mask were significantly more inclinable to electrochemical migration – in the case of the water drop test, the forming dendritic structures shorted the electrodes up to 6 times faster than on PCB without a solder mask, while the samples with correct solder mask exhibited the best resistance against ECM. During the thermal humidity bias test, the electrical short appeared after only 2 hours on PCB with the bad solder mask compared to PCB without the mask, where the dendrites grew after more than 27 hours. Energy dispersive spectroscopy confirmed that the migrating element was tin from the HASL cover layer.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2022 45th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-6589-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Vienna
Event date
May 11, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853642200054