Etching Effects of Low Temperature Hydrogen Plasma on Encapsulated Diamond Transistors
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F12%3A00200580" target="_blank" >RIV/68407700:21340/12:00200580 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Etching Effects of Low Temperature Hydrogen Plasma on Encapsulated Diamond Transistors
Original language description
We study etching effects of low temperature hydrogen plasma treatment (200-300°C) in two different microwave plasma reactors (linear and focused plasma) on diamond solution-gated field-effect transistors with various polymers for encapsulation (MA-P, OFPR, SU8). Three-dimensional transistor microstructures (20um) are grown from nanocrystalline H-terminated intrinsic diamond by MW-CVD on Si/SiO2 substrates.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
BM - Solid-state physics and magnetism
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů