Development of a High-Quality Epoxy Bonding Technology

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F19%3A00339599" target="_blank" >RIV/68407700:21340/19:00339599 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/IPCon.2019.8908302" target="_blank" >https://doi.org/10.1109/IPCon.2019.8908302</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/IPCon.2019.8908302" target="_blank" >10.1109/IPCon.2019.8908302</a>

Result language
angličtina
Original language name
Development of a High-Quality Epoxy Bonding Technology
Original language description
We reported an ytterbium-doped Y 2 O 3 disk with diameter of 11 mm and thickness of 1.2 mm bonded onto a copper heatsink by new high-quality epoxy bonding technology. The disk clear aperture with diameter of 9 mm has the radius of curvature equal to -1586 meters and peak-to-valley value lower than 60 nm. Gain medium with such parameters is ideal for high power laser systems operating in single spatial mode with a pump diameter larger than 3 mm.
Czech name
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Czech description
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Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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