Dividing of metal and plastic components of printed circuit boards

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28110%2F17%3A63517296" target="_blank" >RIV/70883521:28110/17:63517296 - isvavai.cz</a>

Alternative codes found

RIV/70883521:28140/17:63517296

Result on the web

<a href="https://www.matec-conferences.org/articles/matecconf/pdf/2017/39/matecconf_cscc2017_02040.pdf" target="_blank" >https://www.matec-conferences.org/articles/matecconf/pdf/2017/39/matecconf_cscc2017_02040.pdf</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1051/matecconf/201712502040" target="_blank" >10.1051/matecconf/201712502040</a>

Result language

angličtina

Original language name

Dividing of metal and plastic components of printed circuit boards

Original language description

This paper contents one possibility of PCB separation due to the temperature due to the different thermal expansion of the metal path and the plastic from which the boards are made. Using the knowledge from the literary study and the simulation environments used, we have reached the maximum analysis of the problem. The separation of metal and plastic may occur due to temperature changes if the temperature difference is sufficient. We have carried out a study of printed circuit board production so we can choose the appropriate path of separation. Furthermore, we calculated the shear stress size required to tear the conductive copper paths from the epoxy resin. The temperature field in a two-layer board was modeled in the FEMLAB and Pro/ENGINEER programming environments. From the simulated temperature field simulations, conclusions can be drawn that accurately describe the condition and characteristics of materials subjected to heat shock. They derived the resulting relationship for calculating the resulting shear stress needed to separate the conductive paths and plastic materials of the PCB. In our own experiments, we used several ways to heat PCBs. The temperature is also sufficient for the separation of tin. After using the mechanical separation of the components, they were dropped from the PCB. Mechanical separation was also used when removing conductive paths. This separation is effective, but in the newer types of PCBs, the cyclical effects of thermal shock have to be applied to the separation of copper paths. Laboratory tests have demonstrated the viability of the proposed solution. The proposed method of recycling could lead to industrial use, which requires consistent sorting of waste electrical and electronic equipment.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

Result was created during the realization of more than one project. More information in the Projects tab.

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2017

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

MATEC Web of Conferences

ISBN

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ISSN

2261-236X

e-ISSN

neuvedeno

Number of pages

5

Pages from-to

"nestrankovano"

Publisher name

EDP Sciences

Place of publication

Les Ulis

Event location

Heraklion, Crete

Event date

Jul 14, 2017

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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