All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Simulation of printed circuit boards recycling process

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F19%3A63522884" target="_blank" >RIV/70883521:28140/19:63522884 - isvavai.cz</a>

  • Result on the web

    <a href="https://www.matec-conferences.org/articles/matecconf/pdf/2019/41/matecconf_cscc2019_01040.pdf" target="_blank" >https://www.matec-conferences.org/articles/matecconf/pdf/2019/41/matecconf_cscc2019_01040.pdf</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1051/matecconf/201929201040" target="_blank" >10.1051/matecconf/201929201040</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Simulation of printed circuit boards recycling process

  • Original language description

    This paper focused on the modeling of ecological PCB. Due to the high increase in the production of electronic waste, which contains a whole range of usable components, it is necessary to recycle it. About the study of the issue, we have proposed a solution for the separation of conductive paths from plastic and taking into account the legislative approaches and taking into account the existing methods of PCB separation, the composition, and production of PCBs and also the binders used in PCBs. We used the knowledge of process engineering to design a mathematical description of temperature fields in PCB and stress. To a great extent, we have devoted ourselves to the simulation experiments of PCB heating and cooling and the determination of temperature fields and stress due to temperature, cyclic mechanical stresses due to temperature. The simulation is performed in the Pro/ENGINEER and COMSOL Multiphysics® software environments, because of the possibility of solving multi-physical problems. Outputs from computer simulations are the initial stage for designing an eco-friendly way of recycling PCBs. In the future, we will focus on the more difficult issue of recycling multilayer PCBs. The development of new criteria for PCB recycling has opened new possibilities of treatment for used materials.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20205 - Automation and control systems

Result continuities

  • Project

    Result was created during the realization of more than one project. More information in the Projects tab.

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2019

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    MATEC Web of Conferences 292

  • ISBN

  • ISSN

    2261-236X

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    1-4

  • Publisher name

    EDP Sciences

  • Place of publication

    Les Ulis

  • Event location

    Athens

  • Event date

    Jul 14, 2019

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article