Modeling of grinding process by printed circuit boards recycling
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F10%3A63508946" target="_blank" >RIV/70883521:28140/10:63508946 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Modeling of grinding process by printed circuit boards recycling
Original language description
In the paper we deal with the printed circuit boards recycling problem. We focuse on study of a grinding as an alternative method of conductive ways from plastic board separation as one of stages of the printed circuit board recycling procedure. For thispurpose we formulate mathematic model of the grinding process and next we used its analytical solution for its modeling by mathematic software Maple. The obtained results confirm energy intensity of the grinding process.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
CI - Industrial chemistry and chemical engineering
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 21st International DAAAM Symposium "Intelligent Manufacturing & Automation: Focus on Interdisciplinary Solutions"
ISBN
978-3-901509-73-5
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
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Publisher name
DAAAM International Vienna
Place of publication
Vienna
Event location
Zadar, Croatia
Event date
Jan 1, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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