Mass analysis of the components separated from printed circuit boards

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F10%3A63508984" target="_blank" >RIV/70883521:28140/10:63508984 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Mass analysis of the components separated from printed circuit boards

Original language description

Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For this purpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulated mathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plastic elements. We present the obtained results in this paper.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

DM - Solid waste and its control, recycling

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2010

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Acta Montanistica Slovaca

ISSN

1335-1788

e-ISSN

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Volume of the periodical

15

Issue of the periodical within the volume

1

Country of publishing house

SK - SLOVAKIA

Number of pages

4

Pages from-to

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UT code for WoS article

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EID of the result in the Scopus database

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