MASS ANALYSIS OF THE COMPONENTS SEPARATED FROM PRINTED CIRCUIT BOARDS
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F09%3A63507801" target="_blank" >RIV/70883521:28140/09:63507801 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
MASS ANALYSIS OF THE COMPONENTS SEPARATED FROM PRINTED CIRCUIT BOARDS
Original language description
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For this purpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulated mathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plastic elements. We present the obtained results in this paper.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
DM - Solid waste and its control, recycling
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
10th International Carpathian Control Conference
ISBN
83-89772-51-5
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
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Publisher name
Faculty of Mechanical Engineering and Robotics
Place of publication
Cracow
Event location
Zakopane, Poland
Event date
May 27, 2009
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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