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Mathematical model of an integrated circuit cooling through cylindrical rods

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F17%3A63517238" target="_blank" >RIV/70883521:28140/17:63517238 - isvavai.cz</a>

  • Result on the web

    <a href="https://www.itm-conferences.org/articles/itmconf/pdf/2017/01/itmconf_amcse2017_01013.pdf" target="_blank" >https://www.itm-conferences.org/articles/itmconf/pdf/2017/01/itmconf_amcse2017_01013.pdf</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1051/itmconf/20170901013" target="_blank" >10.1051/itmconf/20170901013</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Mathematical model of an integrated circuit cooling through cylindrical rods

  • Original language description

    One of the main challenges in integrated circuits development is to propose alternatives to handle the extreme heat generated by high frequency of electrons moving in a reduced space that cause overheating and reduce the lifespan of the device. The use of cooling fins offers an alternative to enhance the heat transfer using combined a conduction-convection systems. Mathematical model of such process is important for parametric design and also to gain information about temperature distribution along the surface of the transistor. In this paper, we aim to obtain the equations for heat transfer along the chip and the fin by performing energy balance and heat transfer by conduction from the chip to the rod, followed by dissipation to the surrounding by convection. Newton&apos;s law of cooling and Fourier law were used to obtain the equations that describe the profile temperature in the rod and the surface of the chip. Ordinary differential equations were obtained and the respective analytical solutions were derived after consideration of boundary conditions. The temperature along the rod decreased considerably from the initial temperature (in contatct with the chip surface). This indicates the benefit of using a cilindrical rod to distribute the heat generated in the chip.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20303 - Thermodynamics

Result continuities

  • Project

    Result was created during the realization of more than one project. More information in the Projects tab.

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2017

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    ITM Web of Conferences

  • ISBN

  • ISSN

    2271-2097

  • e-ISSN

    neuvedeno

  • Number of pages

    4

  • Pages from-to

    "nestrankovano"

  • Publisher name

    EDP Sciences

  • Place of publication

    Les Ulis

  • Event location

    Řím

  • Event date

    Nov 5, 2016

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000402753800013