Mathematical model of an integrated circuit cooling through cylindrical rods
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F17%3A63517238" target="_blank" >RIV/70883521:28140/17:63517238 - isvavai.cz</a>
Result on the web
<a href="https://www.itm-conferences.org/articles/itmconf/pdf/2017/01/itmconf_amcse2017_01013.pdf" target="_blank" >https://www.itm-conferences.org/articles/itmconf/pdf/2017/01/itmconf_amcse2017_01013.pdf</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1051/itmconf/20170901013" target="_blank" >10.1051/itmconf/20170901013</a>
Alternative languages
Result language
angličtina
Original language name
Mathematical model of an integrated circuit cooling through cylindrical rods
Original language description
One of the main challenges in integrated circuits development is to propose alternatives to handle the extreme heat generated by high frequency of electrons moving in a reduced space that cause overheating and reduce the lifespan of the device. The use of cooling fins offers an alternative to enhance the heat transfer using combined a conduction-convection systems. Mathematical model of such process is important for parametric design and also to gain information about temperature distribution along the surface of the transistor. In this paper, we aim to obtain the equations for heat transfer along the chip and the fin by performing energy balance and heat transfer by conduction from the chip to the rod, followed by dissipation to the surrounding by convection. Newton's law of cooling and Fourier law were used to obtain the equations that describe the profile temperature in the rod and the surface of the chip. Ordinary differential equations were obtained and the respective analytical solutions were derived after consideration of boundary conditions. The temperature along the rod decreased considerably from the initial temperature (in contatct with the chip surface). This indicates the benefit of using a cilindrical rod to distribute the heat generated in the chip.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20303 - Thermodynamics
Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
ITM Web of Conferences
ISBN
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ISSN
2271-2097
e-ISSN
neuvedeno
Number of pages
4
Pages from-to
"nestrankovano"
Publisher name
EDP Sciences
Place of publication
Les Ulis
Event location
Řím
Event date
Nov 5, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000402753800013