Laser brackets debonding - Tm:YAP, Nd:YAG, and GaAs diode lasers evaluation

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11130%2F09%3A5496" target="_blank" >RIV/00216208:11130/09:5496 - isvavai.cz</a>
Alternative codes found
RIV/00064203:_____/09:5496
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Laser brackets debonding - Tm:YAP, Nd:YAG, and GaAs diode lasers evaluation
Original language description
The study demonstrates the possibility of using laser radiation for ceramic bracket removing. Three laser radiations were examined for this effect, and the removing possibility and velocity together with enamel and pulp damage were investigated. The lasers used were: a diode-pumped Tm:YAP microchip laser, diode pumped Nd:YAG laser, and GaAs diode generating 1.9 ?m, 1.44 ?m, and 0.808 ?m, respectively. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel - was also made with the goal to explain the source of heat and bracket debonding. The explanation of the debonding effect is also presented. From the results it is possible to conclude that the continuously running diode pumped microchip Tm:YAP laserhaving output power 1W can be a good candidate for the ceramic bracket debonding procedure.
Czech name
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Czech description
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Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Progress in Biomedical Optics and Imaging - Proceedings of SPIE
ISBN
9780819475114
ISSN
1605-7422
e-ISSN
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Number of pages
6
Pages from-to
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Publisher name
SPIE
Place of publication
San Jose
Event location
San Jose, USA
Event date
Jan 23, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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