Laser Brackets Debonding: Tm:YAP and ClarityTM SL Self-ligating Appliance System
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F10%3A00168316" target="_blank" >RIV/68407700:21340/10:00168316 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Laser Brackets Debonding: Tm:YAP and ClarityTM SL Self-ligating Appliance System
Original language description
The study demonstrates the possibility of using Tm:YAP laser radiation for the ceramic bracket removing. A diode pumped Tm:YAP microchip laser generating a wavelength 1.9 um was used for the debonding process. The amount of enamel loss and residual resinon teeth has been evaluated. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel was analyzed to explain the source of the heat and bracket debonding.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
BH - Optics, masers and lasers
OECD FORD branch
—
Result continuities
Project
—
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of SPIE Vol.7549 - Lasers in Dentistry XVI
ISBN
978-0-8194-7945-7
ISSN
0277-786X
e-ISSN
—
Number of pages
6
Pages from-to
—
Publisher name
SPIE
Place of publication
Washington
Event location
San Francisco
Event date
Jan 23, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000283925700006