Laser Brackets Debonding: Tm:YAP, Nd:YAG, and Two Diode Lasers Evaluation

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F09%3A00156974" target="_blank" >RIV/68407700:21340/09:00156974 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Laser Brackets Debonding: Tm:YAP, Nd:YAG, and Two Diode Lasers Evaluation

Original language description

The study demonstrates the possibility of using laser radiation for ceramic bracket removing. Three laser radiations were examined for this effect, and the removing possibility and velocity together with enamel and pulp damage were investigated. The lasers used were: a diode-pumped Tm:YAP microchip laser, diode pumped Nd:YAG laser, and GaAs diode generating 1.9 um, 1.44 um, and 0.808 um, respectively. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel - was also made with the goal to explain the source of heat and bracket debonding. The explanation of the debonding effect is also presented. From the results it is possible to conclude that the continuously running diode pumped microchip Tm:YAP laserhaving output power 1W can be a good candidate for the ceramic bracket debonding procedure.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

BH - Optics, masers and lasers

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2009

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Proceeding of SPIE 7162 - Lasers in Dentistry XV

ISBN

978-0-8194-7408-7

ISSN

1605-7422

e-ISSN

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Number of pages

6

Pages from-to

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Publisher name

SPIE

Place of publication

Bellingham

Event location

San Jose, (CA)

Event date

Jan 24, 2009

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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