Comparison of shear strength of soldered SMD resistors for various solder alloys
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F15%3A10314573" target="_blank" >RIV/00216208:11320/15:10314573 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/15:00233975
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247997" target="_blank" >http://dx.doi.org/10.1109/ISSE.2015.7247997</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247997" target="_blank" >10.1109/ISSE.2015.7247997</a>
Alternative languages
Result language
angličtina
Original language name
Comparison of shear strength of soldered SMD resistors for various solder alloys
Original language description
Mechanical stability of solder joints has influence on total reliability of electronic products. Mechanical stress affect on properties of solder joints during function, transport and storage of the electronic products. A method which is commonly used inelectronic industry to classify the mechanical properties and reliability of solder joints is shear test. This article deals with the comparison of mechanical stability of soldered joints from the point of shear strength of soldered SMD resistors. Threetypes of solder pastes, one lead Sn62Pb36Ag2 and two lead free Sn42Bi58 and Sn96.5Ag3Cu0.5, were used for solder joint preparation. In addition, influence of solder paste amount on shear strength of soldered SMD component, were compared. The type of solder paste and its applied amount together with the temperature profile are interesting parameters from point of economic aspects, especially in case of mass production, where it is possible to achieve considerable savings. The results sho
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/LM2011025" target="_blank" >LM2011025: MLTL - Magnetism and Low Temperature Laboratories - operation and development of national research infrastructure</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
978-1-4799-8860-0
ISSN
2161-2528
e-ISSN
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Number of pages
4
Pages from-to
237-240
Publisher name
IEEE
Place of publication
New York, USA
Event location
Eger, Hungary
Event date
May 6, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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