Shear Test of Joints Made of Lead-free Solder

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00185537" target="_blank" >RIV/68407700:21230/11:00185537 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Shear Test of Joints Made of Lead-free Solder
Original language description
This paper presents results of mechanical testing of soldered joints made of widely used lead free solder and most popular lead containing one. Measured parameter is shear strength. Tested solders were lead-free Sn-3,8Ag-0,7Cu and lead containing Sn-37Pb. With those solders set of SMD resistors was mounted on pads made of copper and copper electrolytic covered with nickel layer. As mechanical ruggedness of soldered joint strongly depends on presence of intermetallics compounds samples were treated to heat 150 °C 250 and 500 hours and shear strength was measured subsequently and values were compared to ones non thermal aged. Thickness of intermetallics compounds and its influence to shear strength was investigated.
Czech name
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Czech description
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Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
34th International Spring Seminar on Electronics Technology
ISBN
978-1-4577-2111-3
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
84-88
Publisher name
Technical University of Košice
Place of publication
Košice
Event location
Tatranská Lomnica
Event date
May 11, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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