Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00199264" target="_blank" >RIV/68407700:21230/12:00199264 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties
Original language description
The paper presents results of monitoring internal structure of soldered joints, its degradation during elevated temperature treatment (150 °C, up to 3000 hrs.) and influence of those factors on shear strength of the joints. Internal structure of solder joints made of new lead free alloys Sn-0,7Cu, Sn-3,5Ag and Sn-3,7Ag-0,7Cu was observed immediately after reflow using RT analysis. Changes of internal structures of the joints after the ageing were monitored. The main focus was on the presence of intermetallic compounds (IMC) and their genesis after reflow and temperature treatment. Shear strength of soldered joint was measured and the influence of internal structure was discussed.
Czech name
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Czech description
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Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of Electronic Devices and Systems EDS 2012
ISBN
978-80-214-4539-0
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
196-201
Publisher name
VUT v Brně, FEKT
Place of publication
Brno
Event location
Brno
Event date
Jun 28, 2012
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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