Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00199272" target="_blank" >RIV/68407700:21230/12:00199272 - isvavai.cz</a>

Result on the web

<a href="http://www.radioeng.cz/fulltexts/2012/12_02_0573_0579.pdf" target="_blank" >http://www.radioeng.cz/fulltexts/2012/12_02_0573_0579.pdf</a>

DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys

Original language description

During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of intermetallic compounds (IMC) on radio frequency resistance of soldered joint has been identified. Tested solders were lead free Sn-1Cu, Sn-4Ag and Sn-3.8Ag-0.7Cu and lead containing Sn-37Pb (all in weight percent). Samples were annealed up to 3000 hours at 150 °C to accelerated growing of IMC. Radio frequency measuring method has been developed and is described. Influence of IMC on resistance of joint is growing with growing frequency because IMC with slightly different resistivity to base solder is creating barrier to current. Resistance ofjoints has been measured up to 3 GHz.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2012

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Radioengineering

ISSN

1210-2512

e-ISSN

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Volume of the periodical

21

Issue of the periodical within the volume

2

Country of publishing house

CZ - CZECH REPUBLIC

Number of pages

7

Pages from-to

573-579

UT code for WoS article

000305713000006

EID of the result in the Scopus database

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