Mechanical properties of nano-silver ? copper solder joints

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14740%2F13%3A00067949" target="_blank" >RIV/00216224:14740/13:00067949 - isvavai.cz</a>
Result on the web
<a href="http://www.qualitynano.eu/conference/welcome.html" target="_blank" >http://www.qualitynano.eu/conference/welcome.html</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Mechanical properties of nano-silver ? copper solder joints
Original language description
Toxic aspects of lead limit the use of traditional lead-based solders and stimulate the development of new, lead-free joining materials for microelectronics [1]. The emergence of silicon carbide-based electronic devices, operating at high temperatures, has initiated the investigation of alternative, high-melting-point joining materials and novel soldering approaches [2]. Nanoscale silver pastes are promising joining materials due to their low sintering temperature [3]. These materials can be used for soldering at temperatures below 300 stC without the need of an externally applied pressure. Once sintered, the silver joints have a high thermal and electrical conductivity and a high melting point of bulk silver. In the present work, the shear strength and fracture surface morphology of nano-silver-copper joints have been investigated. The silver nanoparticles were prepared by a controlled thermal decomposition of silver bis(dodecylamin)nitrate in argon.
Czech name
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Czech description
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Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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